Plasma Etching Equipment - List of Manufacturers, Suppliers, Companies and Products

Last Updated：Aug 13, 2025 Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

Plasma Etching Equipment Manufacturer, Suppliers and Company Rankings

Last Updated：Aug 13, 2025 Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

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片桐エンジニアリング Kanagawa//Other manufacturing
プラズマ・サーモ・ジャパン Kanagawa//Electronic Components and Semiconductors
4 null/null
5 三友製作所 Ibaraki//Industrial Machinery テクノセンタ

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Plasma Etching Equipment Product ranking

Last Updated：Aug 13, 2025 Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

Single-wafer plasma etching device "EXAM-Σ"
ICP plasma etching device "SERIO"
CCP plasma etching device 'CCP-T60M/B2M' 片桐エンジニアリング
Plasma etching device "EXAM" sample testing now accepting applications.
4 Large plasma etching device

Plasma Etching Equipment Product List

1～11 item / All 11 items

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Tabletop Plasma Etching Device 'TP-50B'

Tabletop plasma etching device capable of localized processing with unique spot plasma technology.

The "TP-50B" is a 50W model that does not require installation permission applications under the Radio Law, and it is easy to operate, making it a tabletop plasma etching device that allows for casual plasma processing. With its unique spot plasma technology, it enables localized processing and can handle a wide range of plasma processing, from pre-treatment (exposing wiring) for semiconductor failure analysis samples to various plasma applications. Additionally, its compact size makes it suitable for research laboratories with limited space. 【Features】 ■ Compact tabletop size ■ Capable of localized plasma processing (Φ0.5mm and above) ■ Achieves low residue and high-speed processing (10μm/min) ■ Low output RF power supply (maximum output under 50W) ■ Allows for extensive processing by moving samples on a stage *For more details, please download the PDF or feel free to contact us.

Company：三友製作所テクノセンタ
Price：Other

Etching Equipment
Other semiconductor manufacturing equipment

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CCP plasma etching device 'CCP-T60M/B2M'

High-precision and high-reliability oxide film microfabrication! Selectively generating radicals from process gases.

The "CCP-T60M/B2M" is a parallel plate etching device that achieves high precision and high reliability in oxide film microfabrication. It selectively generates radicals from process gases and applies 60MHz power to the upper electrode to obtain low electron temperature and high-density plasma. Additionally, it is equipped with a sequence program that constantly maintains appropriate etching process conditions. 【Features】 ■ Parallel plate etching device ■ Achieves high precision and high reliability in oxide film microfabrication ■ Selectively generates radicals from process gases ■ Applies 60MHz power to the upper electrode ■ Equipped with a sequence program *For more details, please refer to the PDF materials or feel free to contact us.

Company：片桐エンジニアリング
Price：Other

Etching Equipment

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Plasma etching equipment for semiconductor failure analysis

Remove the insulation layer of the IC! A system with a small footprint and high cost-effectiveness.

We handle plasma etching equipment for semiconductor failure analysis. From multi-level deprocessing that does not etch the metal layer to maintain electrical characteristics, to processes with high selectivity and no damage, including metal etching, our RIE and ICP-RIE FA solutions can be used for samples of dies, package dies, and wafers up to 200 mm. Please feel free to contact us when you need assistance. 【Features】 ■ Capable of processing dies, package dies, and 200 mm wafers ■ Accumulated process know-how prevents over-etching ■ Compact footprint and cost-effective system * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

Company：プラズマ・サーモ・ジャパン
Price：Other

Semiconductor inspection/test equipment

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Batch-type compound semiconductor mass production machine plasma CVD and plasma etching equipment.

The industry's smallest, designed and manufactured in France, compatible with 2 to 12-inch wafers by simply replacing the wafer tray, Corial 300 and 500 series.

We would like to introduce our thin film PECVD and dry etching equipment, the "SHUTTLELINE(R)" and the compact 300 & 500 series compatible with batch processes. Film deposition is done using PECVD, while etching is performed using RIE, ICP, and ICP-RIE. By utilizing a unique wafer stage, it is possible to batch process from 1 to a maximum of 27 pieces for 2-inch wafers, for example. These systems can be used from development to mass production. 【Features】 ■ The PECVD deposition equipment features a compact chamber design and incorporates automatic cleaning, maximizing throughput. ■ The etching equipment is said to reduce operational costs, making it popular among many micro LED manufacturers. ■ It accommodates various wafer sizes and shapes, including wafer pieces and full wafers, and thanks to the shuttle system (wafer stage), no hardware changes are needed for different sample sizes. *For more details, please feel free to contact us.