We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Plasma Etching Equipment.
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Plasma Etching Equipment Product List and Ranking from 6 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Plasma Etching Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 神港精機 東京支店 Tokyo//Industrial Machinery
  2. 片桐エンジニアリング Kanagawa//Other manufacturing
  3. 三友製作所 テクノセンタ Ibaraki//Industrial Machinery
  4. 4 ナラサキ産業 メカトロソリューション部　機能材料課 Tokyo//Manufacturing and processing contract
  5. 5 プラズマ・サーモ・ジャパン Kanagawa//Electronic Components and Semiconductors
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Plasma Etching Equipment Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. CCP plasma etching device 'CCP-T60M/B2M' 片桐エンジニアリング
  2. Tabletop Plasma Etching Device 'TP-50B' ナラサキ産業 メカトロソリューション部　機能材料課
  3. Single-wafer plasma etching device "EXAM-Σ" 神港精機 東京支店
  4. ICP plasma etching device "SERIO" 神港精機 東京支店
  5. 4 Tabletop Plasma Etching Device 'TP-50B' 三友製作所 テクノセンタ

Plasma Etching Equipment Product List

1～15 item / All 16 items

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Tabletop Plasma Etching Device 'TP-50B'

Tabletop Plasma Etching Device 'TP-50B'

Tabletop plasma etching device capable of localized processing with unique spot plasma technology.

The "TP-50B" is a 50W model that does not require installation permission applications under the Radio Law, and it is an easy-to-operate tabletop plasma etching device that allows for casual plasma processing. With its unique spot plasma technology, it enables localized processing and can handle a wide range of plasma processing from pre-treatment of semiconductor failure analysis samples (exposing wiring) to various plasma applications. Additionally, its compact size makes it suitable for use in research labs with limited space. 【Features】 ■ Compact tabletop size ■ Capable of localized plasma processing (Φ0.5mm and above) ■ Achieves low residue and high-speed processing (10μm/min) ■ Low-output RF power supply (maximum output of less than 50W) ■ Allows for extensive processing by moving the sample on the stage *For more details, please download the PDF or feel free to contact us.

  • Plasma surface treatment equipment

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ICP plasma etching device "SERIO"

ICP plasma etching device "SERIO"

Achieve smooth etching surfaces and high machining precision! We support sample testing!

"SERIO" is a high-density plasma etching device that accommodates a wide range of applications, including deep silicon etching, vertical processing of quartz, and organic film etching. Equipped with a proven ICP plasma electrode, it achieves smooth etching surfaces and high processing precision. It enables smooth etching without scalloping, making it suitable for creating nanoimprint molds. It possesses many process capabilities required for nanoimprint molds, such as smooth etching sidewalls, verticality of the processing surface, and control of opening angles. 【Features】 ■ Smooth etching sidewalls without scalloping ■ High verticality during deep silicon etching (90°±2°) ■ Controllability of etching taper angles ■ Support for high aspect ratio etching ■ Permanent demonstration unit available ■ Sample testing available *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment

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Plasma etching device "EXAM" sample testing now accepting applications.

Plasma etching device "EXAM" sample testing now accepting applications.

A compact batch-type plasma etching device that supports sub-micron etching and features process support through sample testing.

Supports etching of submicron Si oxide films in batch type. Compatible not only with SiN and Si-based thin films but also with high melting point metals and difficult-to-etch materials. Ideal for processing niche devices such as vertical etching of quartz and fine processing of thick photoresist. Actively supports a wide range of applications from ashing to cleaning through a multi-step process enabled by plasma mode switching.

  • Etching Equipment
  • Other physicochemical equipment
  • Plasma Generator

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Tabletop Plasma Etching Device 'TP-50B'

Tabletop Plasma Etching Device 'TP-50B'

Tabletop plasma etching device capable of localized processing with unique spot plasma technology.

The "TP-50B" is a 50W model that does not require installation permission applications under the Radio Law, and it is easy to operate, making it a tabletop plasma etching device that allows for casual plasma processing. With its unique spot plasma technology, it enables localized processing and can handle a wide range of plasma processing, from pre-treatment (exposing wiring) for semiconductor failure analysis samples to various plasma applications. Additionally, its compact size makes it suitable for research laboratories with limited space. 【Features】 ■ Compact tabletop size ■ Capable of localized plasma processing (Φ0.5mm and above) ■ Achieves low residue and high-speed processing (10μm/min) ■ Low output RF power supply (maximum output under 50W) ■ Allows for extensive processing by moving samples on a stage *For more details, please download the PDF or feel free to contact us.

  • Etching Equipment
  • Other semiconductor manufacturing equipment

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CCP plasma etching device 'CCP-T60M/B2M'

CCP plasma etching device 'CCP-T60M/B2M'

High-precision and high-reliability oxide film microfabrication! Selectively generating radicals from process gases.

The "CCP-T60M/B2M" is a parallel plate etching device that achieves high precision and high reliability in oxide film microfabrication. It selectively generates radicals from process gases and applies 60MHz power to the upper electrode to obtain low electron temperature and high-density plasma. Additionally, it is equipped with a sequence program that constantly maintains appropriate etching process conditions. 【Features】 ■ Parallel plate etching device ■ Achieves high precision and high reliability in oxide film microfabrication ■ Selectively generates radicals from process gases ■ Applies 60MHz power to the upper electrode ■ Equipped with a sequence program *For more details, please refer to the PDF materials or feel free to contact us.

  • Etching Equipment

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Wire and tube etching device

Wire and tube etching device

Processing that is stronger than UV treatment but weaker than blasting or polishing is possible. It is suitable for processing elongated workpieces, compact, and has low running costs.

- Can process workpieces with weak mechanical strength - Non-contact treatment that does not damage the workpiece - Does not use liquids - Can process not only metals but also resins - Only Ar gas and water are required for the process - Does not produce dust or waste - Can be installed in clean rooms (excluding vacuum pumps)

  • Other processing machines

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Single-wafer plasma etching device "EXAM-Σ"

Single-wafer plasma etching device "EXAM-Σ"

Carefully responding to niche demands. Light etching and ashing for thin wafers and double-sided processing, compact type CtC etching equipment.

A plasma etching device that realizes automatic sheet transport of thin wafers (100μm or less). It supports a wide range of processes with multi-mode plasma and step processes, from natural oxide film removal to thick film resist ashing, cleaning, and descumming. It is actively used in mass production environments for various devices such as discrete ICs, power devices, compound semiconductors, and MEMS, employing diverse processes.

  • Etching Equipment
  • Ashing device
  • Plasma surface treatment equipment

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HCD type high-density plasma etching device

HCD type high-density plasma etching device

Achieving high-density plasma with a simple mechanism. Compatible with substrates from wafers to 1 m². Damage-free etching of Si-based materials, metals, organic films, and various thin films.

Achieves a plasma density that is an order of magnitude higher compared to conventional capacitively coupled plasma etching devices. High-precision etching is possible solely through innovations in the electrode structure, without using high-frequency antennas or magnets. It also has high hardware compatibility with conventional etching devices (CCP type and ICP type), contributing to low cost, high reliability, and operational efficiency. Capable of etching not only wafer-level substrates but also large substrates. A new type of high-density plasma etching device that can smoothly accommodate the increase in substrate size.

  • Etching Equipment
  • Ashing device
  • Plasma surface treatment equipment

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Large plasma etching device

Large plasma etching device

Batch-type etching equipment with extensive experience in etching and ashing of wafers, glass, and large substrates. Also compatible with semiconductor manufacturing equipment parts and materials.

Based on the highly successful batch-type plasma etching system "EXAM," the stage has been expanded to accommodate a maximum diameter of 600 mm or 500 mm square. The large stage supports a wide range of processes, including fine-pitch etching, ashing of various organic materials, surface modification, and cleaning. Similar to the conventional model EXAM, it performs etching on wafers, glass, and ceramic substrates, and has extensive experience in etching, cleaning, and surface treatment of large mounted substrates and pre-cut film substrates. This new dry process tool is also optimal for processing large products that require cleanliness and delicate surface treatment, such as semiconductor manufacturing equipment parts and materials, in addition to electronic devices.

  • Etching Equipment
  • Plasma surface treatment equipment

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Sanyu Manufacturing Co., Ltd. Company Profile

Sanyu Manufacturing Co., Ltd. Company Profile

With cultivated skills and a new sensibility, we will continue to advance into the new era!

Sanyu Manufacturing Co., Ltd. is a manufacturing company that produces medical analytical instruments, accessories related to electron microscopes, and tools for semiconductor failure analysis. Since its establishment, the company has focused on precision machining, and the technology cultivated there has shaped our technical foundation. By maintaining a consistent production system from design, machining, to assembly and adjustment, we are able to respond to customers' demands for short delivery times. Currently, the majority of our production is related to medical analytical instruments, but in recent years, we have also been engaged in technology development aimed at the next generation. We aim to anticipate our customers' needs and continuously act as challengers, contributing to the advancement of science and the creation of the future. 【Business Activities】 ■ Manufacturing of accessories related to electron microscopes ■ Manufacturing of semiconductor failure analysis tools ■ Precision machining ■ Manufacturing of analytical instrument-related products *For more details, please download the PDF or feel free to contact us.

  • Other semiconductor manufacturing equipment
  • Contract manufacturing

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Plasma etching equipment for semiconductor failure analysis

Plasma etching equipment for semiconductor failure analysis

Remove the insulation layer of the IC! A system with a small footprint and high cost-effectiveness.

We handle plasma etching equipment for semiconductor failure analysis. From multi-level deprocessing that does not etch the metal layer to maintain electrical characteristics, to processes with high selectivity and no damage, including metal etching, our RIE and ICP-RIE FA solutions can be used for samples of dies, package dies, and wafers up to 200 mm. Please feel free to contact us when you need assistance. 【Features】 ■ Capable of processing dies, package dies, and 200 mm wafers ■ Accumulated process know-how prevents over-etching ■ Compact footprint and cost-effective system * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

  • Semiconductor inspection/test equipment

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Batch-type compound semiconductor mass production machine plasma CVD and plasma etching equipment.

Batch-type compound semiconductor mass production machine plasma CVD and plasma etching equipment.

The industry's smallest, designed and manufactured in France, compatible with 2 to 12-inch wafers by simply replacing the wafer tray, Corial 300 and 500 series.

We would like to introduce our thin film PECVD and dry etching equipment, the "SHUTTLELINE(R)" and the compact 300 & 500 series compatible with batch processes. Film deposition is done using PECVD, while etching is performed using RIE, ICP, and ICP-RIE. By utilizing a unique wafer stage, it is possible to batch process from 1 to a maximum of 27 pieces for 2-inch wafers, for example. These systems can be used from development to mass production. 【Features】 ■ The PECVD deposition equipment features a compact chamber design and incorporates automatic cleaning, maximizing throughput. ■ The etching equipment is said to reduce operational costs, making it popular among many micro LED manufacturers. ■ It accommodates various wafer sizes and shapes, including wafer pieces and full wafers, and thanks to the shuttle system (wafer stage), no hardware changes are needed for different sample sizes. *For more details, please feel free to contact us.

  • Etching Equipment

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Multi-Purpose Etching and Coating Solutions

Multi-Purpose Etching and Coating Solutions

Etching and film deposition for a wide range of markets, including fault analysis, MEMS, optical MEMS, and advanced packaging, are possible!

The "Shuttleline200 Series" is a flexible and multipurpose platform for etching and PECVD applications. By adopting a unique shuttle concept, it enables handling of samples in various sizes, from small pieces to full wafers, providing a multipurpose etching and deposition solution. It also allows for plasma processing technologies such as RIE, ICP, PECVD, and ICP-CVD, offering suitable processing for R&D applications and small-scale production. Specifically, it can perform etching and deposition for a wide range of markets, including failure analysis, MEMS, optical MEMS, advanced packaging, and processes for power semiconductors. 【Features】 ■ Easily adaptable to a wide variety of substrate shapes and sizes due to the unique shuttle concept. ■ User-friendly equipment with a wealth of options and high upgradeability. ■ Multipurpose capability to meet advanced and specific requirements such as RIE and ICP etching. *For more details, please feel free to contact us.

  • others

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Notice of Participation in "Semicon Japan 2024" and Seminar Hosting

Notice of Participation in "Semicon Japan 2024" and Seminar Hosting

At the seminar, we plan to introduce new technologies such as HDRF-high-density radicals for low-temperature removal of polymers and HDI resists.

Plasma Thermo Japan Co., Ltd. will be exhibiting at "Semicon Japan 2024" held at Tokyo Big Sight. Our company specializes in plasma technology, handling etching, deposition, cleaning equipment, ALD-like deposition equipment, ion beam equipment, PVD equipment, and RTP equipment. We also offer batch-type sputtering equipment and electron beam evaporation equipment, enabling us to propose solutions for various applications. In the seminar held at our booth, we plan to introduce new technologies that enable low-temperature removal of polymers and HDI resist using HDRF-high-density radicals, as well as new technologies for ALD-like deposition with the deposition rate of KBOUS FAST-CVD. We look forward to your visit. 【Event Overview】 ■ Dates: December 11 (Wed) - 13 (Fri), 2024, 10:00 - 17:00 ■ Venue: Tokyo Big Sight, East Hall 4, Booth 4032 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Nearest Stations: - Rinkai Line, Kokusai-Tenjijo Station (approximately 7 minutes on foot) - Yurikamome, Tokyo Big Sight Station (approximately 3 minutes on foot) *For more details, please refer to the related links or feel free to contact us.

  • Etching Equipment

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MEMS Engineer Forum - Notice of Technical Exhibition

MEMS Engineer Forum - Notice of Technical Exhibition

Improving the precision and efficiency of MEMS processing! We will introduce high-precision etching and film deposition technologies. *Held from April 16 to April 17.

Plasma Thermo Japan Co., Ltd. will exhibit at the technical exhibition corner of the "MEMS Engineer Forum 2025" held at the International Fashion Center Building (KFC Hall) in Ryogoku, Tokyo. <Exhibition Contents> 1. Low-temperature, low-damage etching and cleaning equipment using high-density radicals The patented HDRF technology (High Density Radical Flux) eliminates the causes of yield reduction in MEMS. 2. Processing technology essential for future high-frequency devices and high-speed optical modulation waveguide processing (Ion Beam Etching) Ion beam etching suitable for processing multilayer structures. The tilt mechanism of the wafer stage allows for adjustment of side wall angles. 3. Plasma etching and film deposition equipment suitable for batch processing of compound semiconductors Multiple wafers can be loaded onto a "shuttle" (wafer carrier) for batch processing. This equipment is suitable for small-scale production. We sincerely look forward to your visit. *You can download the equipment catalog. *Please feel free to contact us for more details.

  • Etching Equipment

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